HBM memory manufacturers
SK hynix, Samsung and Micron supply commercial HBM, with 50%, 33% and 18% of Q2 2026 HBM revenue (Counterpoint Research). China’s CXMT has reported HBM samples. Compare generations, 36 GB reference stacks, logic base dies, capacity plans and named customers.
| SK hynix | HBM3E 12-layer reference stack1 | 361 | 121 | HBM3E pin speed: 9.6 Gbps1 | 2026-11-11 |
|---|---|---|---|---|---|
| Samsung Electronics | HBM4 12-layer reference stack1 | 361 | 121 | HBM4 bandwidth: up to 3.3 TB/s per stack1 | 2026-11-11 |
| Micron Technology | HBM4 36GB 12H reference stack1 | 361 | 121 | HBM4 bandwidth: greater than 2.8 TB/s per stack1 | 2026-11-11 |
| CXMT | HBM sample chips (reported May 2024)1 | — | — | Samples reportedly shown to clients1 | 2026-11-11 |
Who supplies the memory stack?
Check the exact stack part, package height, pin speed and platform qualification. The reference capacity is attached to the named product, not the supplier’s entire portfolio. SK hynix’s reference specification here is HBM3E; the Samsung and Micron references are HBM4.
- SK hynix — Makes HBM stacks for AI accelerators and led HBM revenue in Q2 2026. Its 12-layer HBM3E is in volume production, and its 12-layer 36GB HBM4 ships in NVIDIA Vera Rubin. Reference source
- Samsung Electronics — Makes HBM memory and its own 4 nm logic base dies. Its commercial HBM4 runs at 11.7 Gbps per pin, and it is AMD's primary HBM3E partner for Instinct MI350X and MI355X. Reference source
- Micron Technology — Makes HBM for accelerator platforms. Its HBM4 release states volume shipments and names the NVIDIA platform the memory is designed for. Reference source
- CXMT — Develops HBM sample chips with Tongfu Microelectronics, according to Reuters reporting in May 2024. Track it as the emerging Chinese HBM source. Reference source
Base-die logic and foundry relationships
- SK hynix: HBM4: TSMC advanced logic process, under April 2024 collaboration agreement 4
- Samsung Electronics: HBM4 and HBM4E: Samsung Foundry 4 nm logic base die 3
- Micron Technology: HBM4: in-house advanced CMOS base die 4
Published HBM revenue shares
These are dated research estimates of HBM revenue. Rounding can put the total above or below the whole market. They do not measure stack shipments or available allocation.
- SK hynix: 50% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 3
- Samsung Electronics: 33% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 2
- Micron Technology: 18% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 2
Dated capacity and expansion disclosures
- SK hynix: October 2026 results: targets M15X maximum-capacity ramp by year-end 2026 to increase HBM4 output; output quantity undisclosed 6
- Samsung Electronics: October 2026 results: HBM4 sales scaled up; Q4 plan to increase HBM supply and sales; no wafer-output figure disclosed 5
- Micron Technology: January 2025 plan: approximately US$7 billion Singapore HBM packaging investment; meaningful capacity expansion from calendar 2027 5