Micron Technology
Makes HBM for accelerator platforms. Its HBM4 release states volume shipments and names the NVIDIA platform the memory is designed for.
Facts
Source per value- Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
- Memory 1
- Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
- HBM4 36GB 12H reference stack 1
- Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
- HBM4 stacked memory for accelerator integration 1
- Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
- HBM4 bandwidth: greater than 2.8 TB/s per stack 1
- HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
- HBM3E; HBM4; HBM4E (development; volume production expected in calendar 2027) 13
- Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
- 36 1
- Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
- 12 1
- Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
- NVIDIA Vera Rubin (designed for) 1
- Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
- January 2025 plan: approximately US$7 billion Singapore HBM packaging investment; meaningful capacity expansion from calendar 2027 5
- Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
- 18% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 2
- HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
- HBM4: in-house advanced CMOS base die 4
- Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
- Not published
Sources
- Micron: high-volume HBM4 for NVIDIA Vera Rubin, 16 Mar 2026 accessed 2026-11-11
- Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026 accessed 2026-11-11
- Micron: fiscal 2026 quarterly results, HBM4E development outlook accessed 2026-11-11
- Micron: fiscal Q4 2025 prepared remarks, HBM4 base die accessed 2026-11-11
- Micron: Singapore HBM advanced-packaging groundbreaking, 8 Jan 2025 accessed 2026-11-11
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