Micron Technology

Makes HBM for accelerator platforms. Its HBM4 release states volume shipments and names the NVIDIA platform the memory is designed for.

Memory

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Memory 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
HBM4 36GB 12H reference stack 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
HBM4 stacked memory for accelerator integration 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
HBM4 bandwidth: greater than 2.8 TB/s per stack 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM3E; HBM4; HBM4E (development; volume production expected in calendar 2027) 13
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
36 1
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
12 1
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
NVIDIA Vera Rubin (designed for) 1
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
January 2025 plan: approximately US$7 billion Singapore HBM packaging investment; meaningful capacity expansion from calendar 2027 5
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
18% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 2
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
HBM4: in-house advanced CMOS base die 4
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. Micron: high-volume HBM4 for NVIDIA Vera Rubin, 16 Mar 2026 accessed 2026-11-11
  2. Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026 accessed 2026-11-11
  3. Micron: fiscal 2026 quarterly results, HBM4E development outlook accessed 2026-11-11
  4. Micron: fiscal Q4 2025 prepared remarks, HBM4 base die accessed 2026-11-11
  5. Micron: Singapore HBM advanced-packaging groundbreaking, 8 Jan 2025 accessed 2026-11-11
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