HBMsuppliers

HBM substrates and packaging materials

Compare package substrates from IBIDEN, Unimicron, Shinko and AT&S with stacking film, mold underfill, wafer-support materials and CMP consumables. These products serve different layers and process steps.

All suppliers / Definitions and source policy

Ajinomoto Fine-TechnoAjinomoto Build-up Film (ABF)1Interlayer insulation for build-up package substrates1Film enables simultaneous processing on both substrate sides12026-11-11
AT&SHigh-end IC substrates; Kulim ABF substrates12FCBGA/FCLGA substrate fabrication for high-performance processors1Kulim technology portfolio includes up to 26 layers and 5 µm line/space12026-11-11
EntegrisAdvanced-packaging CMP pads, slurries and post-CMP cleaning solutions1Planarization consumables; residue removal and slurry filtration1Integrated chemistry, pads, cleaning and process monitoring for surface planarity and defect control12026-11-11
HenkelLOCTITE ECCOBOND NCF 200 series; NCP 52091Bump protection and underfill curing during thermo-compression bonding1Films target fine-pitch, narrow-gap interconnects in memory and 3D TSV stacks12026-11-11
IBIDENAdvanced IC package substrates1Automated package-substrate production at Ono Plant1Ono Plant: sequential mass-production start scheduled from October 2025, primarily for AI server substrates12026-11-11
NAMICSLiquid Compression Mold Underfill (LCMUF)1Single-step compression molding of interposer-to-chip gaps and chip periphery1Commercialized for mass production; resin/filler design balances flowability and warpage12026-11-11
ResonacNon-conductive film (NCF); thermal conductive sheet (TIM)1NCF bonding and stacking of multilayer HBM1NCF connects stacked HBM layers; TIM supports heat transfer12026-11-11
Shinko Electric Industriesi-THOP 2.3D package substrate (under development)1Organic thin-film interposer integrated with build-up substrate; chip-last assembly1Published design rules: 40 µm flip-chip pad pitch; 2/2 µm line/space12026-11-11
Sumitomo BakeliteSUMIKON EME mold underfill; compression-molding granules1MUF filling of solder joints and encapsulation in one molding step1Resin viscosity and filler distribution tailored for narrow-gap filling and low warpage12026-11-11
Toray IndustriesTemporary bonding material for ultra-thin semiconductor wafers (samples)1Temporary carrier bonding during wafer thinning1Targets wafers 30 µm or less in thickness12026-11-11
UnimicronFC-BGA package substrates1Build-up wiring and core-layer interconnects12026 roadmap target: 150 × 150 mm body size and 5/7 µm build-up line/space12026-11-11

Who supplies the substrate and materials around HBM?

Match the purchase to the layer: an organic package substrate, the insulation between its copper layers, and non-conductive film inside a memory stack have different specifications. Ask for the qualified material grade and reliability data, and check each dated expansion plan against your ramp.

  • Ajinomoto Fine-Techno — Supplies the insulating build-up film used between copper wiring layers in semiconductor package substrates. It is a substrate-material supplier in the wider packaging chain. Reference source
  • AT&S — Manufactures high-end IC package substrates for high-performance processors. Its Kulim, Malaysia plant, backed by a US$250 million IFC loan, supplies AMD data-center processors. Reference source
  • Entegris — Supplies CMP consumables and contamination-control materials for advanced packaging. Entegris also documents filtration and purification research for HBM manufacturing. Reference source
  • Henkel — Supplies non-conductive film and paste for fine-pitch memory and 3D TSV assemblies: the materials that protect bumps during thermo-compression bonding. Reference source
  • IBIDEN — Supplies IC package substrates for AI servers and networking. Its new Ono Plant began sequential mass production of advanced substrates from October 2025. Reference source
  • NAMICS — Supplies liquid compression mold underfill for advanced semiconductor packages. Its LCMUF encapsulates interposer-to-chip gaps and the chip periphery in a single molding step. Reference source
  • Resonac — Supplies non-conductive film for connecting and stacking HBM dies. Its disclosed expansion plan covers both film and thermal-interface materials. Reference source
  • Shinko Electric Industries — Develops i-THOP organic interposer substrates for heterogeneous integration including HBM. The supplier labels this platform under development. Reference source
  • Sumitomo Bakelite — Supplies mold-underfill and granular encapsulation materials for advanced semiconductor packaging. Its semiconductor materials disclosures include HBM encapsulation applications. Reference source
  • Toray Industries — Develops temporary bonding material to support ultra-thin wafers for next-generation HBM and other devices. Its November 2025 announcement describes sample shipments and a future volume-manufacturing plan. Reference source
  • Unimicron — Manufactures FC-BGA package substrates in the wider accelerator packaging chain. The recorded design rules are roadmap targets reproduced in Meritz research, not proof of HBM qualification. Reference source

Dated capacity and expansion disclosures

  • AT&S: March 2025: US$250 million IFC loan signed to support Kulim substrate plant expansion; HBM-specific output undisclosed 2
  • IBIDEN: October 2025 opening notice: Ono Plant completed January 2025; sequential mass production scheduled from October 2025; HBM-specific output undisclosed 1
  • Resonac: 2024 plan: expand NCF/TIM capacity to 3.5–5× then-current level 1
  • Sumitomo Bakelite: October 2026 plan: approximately double MUF capacity and triple granule capacity; new Singapore/Suzhou lines scheduled for end-FY2028/FY2030 1
  • Toray Industries: November 2025 plan: use existing facilities to launch volume manufacturing by 2028 1