# HBM Suppliers

> SK hynix leads HBM with 50% of Q2 2026 revenue, ahead of Samsung at 33% and Micron at 18% (Counterpoint Research). Compare 41 HBM supply-chain suppliers across six stages, from bonders and CoWoS packaging to testers and substrates, with sourced generations, capacity plans and named customers.

Trace the stack. Find the supplier. 41 suppliers, each field linked to its public source, last verified 2026-11-11.
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## Data
- [HBM suppliers](https://hbmsuppliers.com/): the full comparison table
- [Data (JSON)](https://hbmsuppliers.com/data.json): every record with sources
- [Data (CSV)](https://hbmsuppliers.com/data.csv): one row per supplier
- [Methodology](https://hbmsuppliers.com/methodology/): what each field means and how it is verified

## Suppliers
- [ACM Research](https://hbmsuppliers.com/acm-research/): Supplies electrochemical plating systems for TSVs, interposers and wafer-level packaging, covering copper, nickel, tin-silver and gold plating.
- [Advantest](https://hbmsuppliers.com/advantest/): Supplies memory test equipment covering high-bandwidth memory devices. The reference tester specifies channel count, speed and timing accuracy.
- [Ajinomoto Fine-Techno](https://hbmsuppliers.com/ajinomoto-fine-techno/): Supplies the insulating build-up film used between copper wiring layers in semiconductor package substrates. It is a substrate-material supplier in the wider packaging chain.
- [Amkor Technology](https://hbmsuppliers.com/amkor/): Processes TSV-bearing wafers and assembles advanced packages. Its service starts with pre-formed vias and includes reveal and backside metallization.
- [Applied Materials](https://hbmsuppliers.com/applied-materials/): Supplies materials-processing equipment for DRAM and stacked-chip packaging. Its deposition platform fills vias and forms interconnects around the HBM stack.
- [ASE](https://hbmsuppliers.com/ase/): Packages logic and HBM together using interposers and fan-out platforms. Its published specifications distinguish routing density from the number of memory stacks.
- [ASMPT](https://hbmsuppliers.com/asmpt/): Supplies thermo-compression bonding equipment for heterogeneous integration. Its HBM-specific work includes a fluxless process using active oxide removal.
- [AT&S](https://hbmsuppliers.com/at-s/): Manufactures high-end IC package substrates for high-performance processors. Its Kulim, Malaysia plant, backed by a US$250 million IFC loan, supplies AMD data-center processors.
- [Besi](https://hbmsuppliers.com/besi/): Supplies hybrid-bonding equipment for dense interconnects and 3D integration. Its Q1 2026 results report hybrid-bonding evaluation tools for HBM.
- [Camtek](https://hbmsuppliers.com/camtek/): Supplies optical inspection and metrology equipment for HBM, chiplets and hybrid bonding. Its Hawk platform measures dense bump arrays.
- [CXMT](https://hbmsuppliers.com/cxmt/): Develops HBM sample chips with Tongfu Microelectronics, according to Reuters reporting in May 2024. Track it as the emerging Chinese HBM source.
- [DISCO](https://hbmsuppliers.com/disco/): Supplies grinding and polishing equipment for thin-wafer processing. Its DGP8761 grinds and stress-relief polishes 200 mm and 300 mm wafers to 25 µm or less.
- [EBARA](https://hbmsuppliers.com/ebara/): Supplies CMP and plating systems used in semiconductor processing. Ebara targets planarization demand from HBM and CoWoS packaging.
- [Entegris](https://hbmsuppliers.com/entegris/): Supplies CMP consumables and contamination-control materials for advanced packaging. Entegris also documents filtration and purification research for HBM manufacturing.
- [EV Group](https://hbmsuppliers.com/ev-group/): Supplies temporary wafer bonding equipment that supports thin-wafer handling and backside processing. The open adhesive platform supports several carrier materials.
- [FormFactor](https://hbmsuppliers.com/formfactor/): Supplies MEMS probe cards for known-good-die memory testing before package assembly. The HFTAP platform also tests devices used in HBM stacks.
- [HANMI Semiconductor](https://hbmsuppliers.com/hanmi/): Supplies thermal-compression bonders for stacked memory and HBM package inspection equipment. The listed product family comes from its equipment catalogue.
- [Hanwha Semitech](https://hbmsuppliers.com/hanwha-semitech/): Supplies thermo-compression bonders for HBM manufacturing, with TC bonder contracts at SK hynix. Its SHB2 Nano hybrid bonder was announced for customer performance testing in H1 2026.
- [Henkel](https://hbmsuppliers.com/henkel/): Supplies non-conductive film and paste for fine-pitch memory and 3D TSV assemblies: the materials that protect bumps during thermo-compression bonding.
- [IBIDEN](https://hbmsuppliers.com/ibiden/): Supplies IC package substrates for AI servers and networking. Its new Ono Plant began sequential mass production of advanced substrates from October 2025.
- [KLA](https://hbmsuppliers.com/kla/): Supplies inspection and metrology for advanced wafer-level packaging. Kronos and ICOS tools cover inline wafer inspection plus post-dicing inspection and sorting.
- [Lam Research](https://hbmsuppliers.com/lam-research/): Supplies TSV etch and plating equipment used in HBM manufacturing. The SABRE family also supports bumping and redistribution layers.
- [Micron Technology](https://hbmsuppliers.com/micron/): Makes HBM for accelerator platforms. Its HBM4 release states volume shipments and names the NVIDIA platform the memory is designed for.
- [NAMICS](https://hbmsuppliers.com/namics/): Supplies liquid compression mold underfill for advanced semiconductor packages. Its LCMUF encapsulates interposer-to-chip gaps and the chip periphery in a single molding step.
- [Onto Innovation](https://hbmsuppliers.com/onto-innovation/): Supplies inspection and metrology for HBM packaging. Its Dragonfly release reports selection by an unnamed memory manufacturer for an HBM4 ramp.
- [Resonac](https://hbmsuppliers.com/resonac/): Supplies non-conductive film for connecting and stacking HBM dies. Its disclosed expansion plan covers both film and thermal-interface materials.
- [Samsung Electronics](https://hbmsuppliers.com/samsung/): Makes HBM memory and its own 4 nm logic base dies. Its commercial HBM4 runs at 11.7 Gbps per pin, and it is AMD's primary HBM3E partner for Instinct MI350X and MI355X.
- [SCREEN Semiconductor Solutions](https://hbmsuppliers.com/screen/): Supplies wafer cleaning equipment in the memory manufacturing chain. SCREEN cites HBM investment exposure; the SU-3400 specifications here are general wafer-cleaning capabilities.
- [SEMES](https://hbmsuppliers.com/semes/): Manufactures thermal-compression bonders for NCF-based HBM stacking. Its June 2024 disclosure also describes hybrid-bonding development for processes beyond HBM4.
- [Shinko Electric Industries](https://hbmsuppliers.com/shinko/): Develops i-THOP organic interposer substrates for heterogeneous integration including HBM. The supplier labels this platform under development.
- [SK hynix](https://hbmsuppliers.com/sk-hynix/): Makes HBM stacks for AI accelerators and led HBM revenue in Q2 2026. Its 12-layer HBM3E is in volume production, and its 12-layer 36GB HBM4 ships in NVIDIA Vera Rubin.
- [SPIL](https://hbmsuppliers.com/spil/): Provides HBM-integrated fan-out and 2.5D packaging services. Its annual report lists embedded-bridge and TSV-enabled integration alongside conventional package assembly.
- [Sumitomo Bakelite](https://hbmsuppliers.com/sumitomo-bakelite/): Supplies mold-underfill and granular encapsulation materials for advanced semiconductor packaging. Its semiconductor materials disclosures include HBM encapsulation applications.
- [SUSS](https://hbmsuppliers.com/suss/): Supplies temporary bonding and debonding systems for HBM wafer thinning. Its platforms also clean adhesive residues after the carrier is removed.
- [Teradyne](https://hbmsuppliers.com/teradyne/): Supplies a tester for HBM base dies and stacks before and after singulation. Its published interface speed is a tester specification, measured differently from memory pin speed.
- [Tokyo Electron](https://hbmsuppliers.com/tokyo-electron/): Supplies temporary bonding and debonding tools for the thin silicon layers used in HBM, plus a permanent-bonding platform for 3D integration.
- [Toray Industries](https://hbmsuppliers.com/toray/): Develops temporary bonding material to support ultra-thin wafers for next-generation HBM and other devices. Its November 2025 announcement describes sample shipments and a future volume-manufacturing plan.
- [TOWA](https://hbmsuppliers.com/towa/): Supplies molding equipment for stacked-memory packaging. Its HBM4 process announcement identifies a narrow-gap underfill technology and the target equipment series.
- [TSMC](https://hbmsuppliers.com/tsmc/): Provides the interposer-based packaging that connects processors to HBM stacks. CoWoS is an integration service for the complete accelerator package.
- [Unimicron](https://hbmsuppliers.com/unimicron/): Manufactures FC-BGA package substrates in the wider accelerator packaging chain. The recorded design rules are roadmap targets reproduced in Meritz research, not proof of HBM qualification.
- [Yamaha Robotics (SHINKAWA)](https://hbmsuppliers.com/yamaha-robotics/): Supplies SHINKAWA-series package bonders for thermo-compression assembly. Yamaha positions the FPB-1s NeoForce for TSV-based HBM applications.

## Optional
- [All records in one file](https://hbmsuppliers.com/llms-full.txt)
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