HBM inspection and packaging metrology
Camtek, Onto Innovation and KLA document inspection or metrology platforms for dense advanced packaging. Compare the defect type, measurement step and specified sensitivity for the actual recipe.
| Camtek | Hawk1 | Wafer defect inspection; bump and overlay metrology1 | Defect sensitivity down to 0.1 µm; more than 500 million bumps per wafer1 | 2026-11-11 |
|---|---|---|---|---|
| KLA | Kronos 1190; ICOS F160XP1 | Inline wafer inspection; post-dicing inspection and sorting1 | Kronos uses high-resolution optics for dense packaging patterns1 | 2026-11-11 |
| Onto Innovation | Dragonfly G5; 3Di1 | 2D defect inspection and 3D metrology1 | Dragonfly G5 detects defects as small as 150 nm1 | 2026-11-11 |
Who inspects bumps, defects and package alignment?
Optical defect detection and electrical testing answer different questions. Sensitivity depends on material, optics and inspection mode, so send a sample wafer with the recipe you run.
- Camtek — Supplies optical inspection and metrology equipment for HBM, chiplets and hybrid bonding. Its Hawk platform measures dense bump arrays. Reference source
- KLA — Supplies inspection and metrology for advanced wafer-level packaging. Kronos and ICOS tools cover inline wafer inspection plus post-dicing inspection and sorting. Reference source
- Onto Innovation — Supplies inspection and metrology for HBM packaging. Its Dragonfly release reports selection by an unnamed memory manufacturer for an HBM4 ramp. Reference source