HBMsuppliers

Samsung Electronics

Makes HBM memory and its own 4 nm logic base dies. Its commercial HBM4 runs at 11.7 Gbps per pin, and it is AMD's primary HBM3E partner for Instinct MI350X and MI355X.

Memory

Verified

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Memory 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
HBM4 12-layer reference stack 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
1c DRAM with 4 nm logic base die; low-voltage TSV 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
HBM4 bandwidth: up to 3.3 TB/s per stack 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM3E; HBM4; HBM4E (samples shipped June 2026) 13
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
36 1
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
12 1
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
AMD Instinct MI350X/MI355X (primary HBM3E partner); MI455X (HBM4 supply collaboration under March 2026 MOU) 4
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
October 2026 results: HBM4 sales scaled up; Q4 plan to increase HBM supply and sales; no wafer-output figure disclosed 5
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
33% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 2
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
HBM4 and HBM4E: Samsung Foundry 4 nm logic base die 3
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. Samsung: commercial HBM4 shipments, 12 Feb 2026 accessed 2026-11-11
  2. Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026 accessed 2026-11-11
  3. Samsung: HBM4E samples and base-die process, 1 Jun 2026 accessed 2026-11-11
  4. Samsung and AMD: memory collaboration and HBM4 MOU, Mar 2026 accessed 2026-11-11
  5. Samsung: third-quarter 2026 results and HBM outlook, 29 Oct 2026 accessed 2026-11-11
HBM memory manufacturers

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