HBMsuppliers

HBM bonding, TSV and wafer-processing equipment

These suppliers cover die bonding, TSV etch and fill, temporary wafer support, grinding and molding. Choose the process step first: these tools perform different jobs in the manufacturing flow.

All suppliers / Definitions and source policy

ACM ResearchUltra ECP 3d; Ultra ECP ap1TSV fill and interconnect metal plating for 3D integration1Platform covers Cu, Ni, SnAg and gold plating for vias, pillars, bumps and RDL12026-11-11
Applied MaterialsNokota VMax 2; Kinex (with Besi)12TSV/microbump copper plating; integrated die-to-wafer hybrid bonding12Platform spans TSV filling and fine-pitch interconnect plating12026-11-11
ASMPTFIREBIRD TCB; AOR TCB12Thermo-compression bonding; active oxide removal12FIREBIRD placement accuracy: ±2.0 µm12026-11-11
BesiDatacon 8800 CHAMEO ultra plus AC1Hybrid bonding with optical alignment1Platform targets high-density interconnects and 3D integration12026-11-11
DISCODGP8761 grinder/polisher1Backgrinding followed by stress-relief polishing1Supports 200 mm and 300 mm wafers; finish thickness 25 µm or less12026-11-11
EBARAF-REX300X CMP; UFP-AS plating1Chemical mechanical planarization; bump, RDL and via electroplating1F-REX300X: 300 mm wafers; UFP-AS: panels up to 600 × 600 mm12026-11-11
EV GroupEVG850 TB1Adhesive coating; baking; alignment; temporary carrier bonding1Substrate size: up to 300 mm; silicon, glass or sapphire carriers12026-11-11
HANMI SemiconductorTC Bonder 4.5 Griffin (June 2026 order)2Thermal-compression bonding for HBM1Catalogue also lists HBM 6-SIDE INSPECTION 1.012026-11-11
Hanwha SemitechSFM5-Expert TC bonder; SHB2 Nano (evaluation-stage hybrid bonder)13Thermo-compression die stacking; hybrid bonding development123TC bonders in mass production; hybrid system announced for customer performance testing in H1 2026132026-11-11
Lam ResearchSyndion TSV etch; SABRE 3D plating2TSV etch; copper electrochemical deposition2SABRE 3D supports Cu/SnAg and Ni/Au microbumps12026-11-11
SCREEN Semiconductor SolutionsSU-3400 single-wafer cleaner1Particle removal in wafer wet-cleaning steps1Single-wafer cleaning platform for advanced logic and memory processing12026-11-11
SEMESHBM Thermal Compression Bonder1Heat/pressure alignment and vertical stacking of TSV-equipped chips1NCF-method stacking with alignment control under high bonding loads12026-11-11
SUSSXBS300; XBC3001Temporary bonding; debonding; adhesive-residue cleaning1Platforms support the three wafer-support sub-processes for HBM thinning12026-11-11
Tokyo ElectronSynapse V; Synapse Z Plus; Synapse Si1Temporary bond/debond for TSV processing; hybrid/fusion bonding1Synapse Si combines Cu hybrid and fusion bonding processes12026-11-11
TOWACPM series (announced application)1Compression molding; ultra-narrow-gap mold underfill1Announced technology targets narrow gaps in HBM4 stacks12026-11-11
Yamaha Robotics (SHINKAWA)FPB-1s NeoForce (SHINKAWA series)1Chip-to-substrate TCB with NCP, NCF or TC-CUF1Bonding force up to 350 N; handles up to four chip product types12026-11-11

Which tools build and protect the stack?

Permanent die bonding joins the stack; temporary bonding supports thin wafers during processing. Thermal compression, hybrid bonding and mold underfill are distinct processes. Ask for the wafer format, alignment budget, gap specification, material compatibility and qualification status of the exact configuration.

  • ACM Research — Supplies electrochemical plating systems for TSVs, interposers and wafer-level packaging, covering copper, nickel, tin-silver and gold plating. Reference source
  • Applied Materials — Supplies materials-processing equipment for DRAM and stacked-chip packaging. Its deposition platform fills vias and forms interconnects around the HBM stack. Reference source
  • ASMPT — Supplies thermo-compression bonding equipment for heterogeneous integration. Its HBM-specific work includes a fluxless process using active oxide removal. Reference source
  • Besi — Supplies hybrid-bonding equipment for dense interconnects and 3D integration. Its Q1 2026 results report hybrid-bonding evaluation tools for HBM. Reference source
  • DISCO — Supplies grinding and polishing equipment for thin-wafer processing. Its DGP8761 grinds and stress-relief polishes 200 mm and 300 mm wafers to 25 µm or less. Reference source
  • EBARA — Supplies CMP and plating systems used in semiconductor processing. Ebara targets planarization demand from HBM and CoWoS packaging. Reference source
  • EV Group — Supplies temporary wafer bonding equipment that supports thin-wafer handling and backside processing. The open adhesive platform supports several carrier materials. Reference source
  • HANMI Semiconductor — Supplies thermal-compression bonders for stacked memory and HBM package inspection equipment. The listed product family comes from its equipment catalogue. Reference source
  • Hanwha Semitech — Supplies thermo-compression bonders for HBM manufacturing, with TC bonder contracts at SK hynix. Its SHB2 Nano hybrid bonder was announced for customer performance testing in H1 2026. Reference source
  • Lam Research — Supplies TSV etch and plating equipment used in HBM manufacturing. The SABRE family also supports bumping and redistribution layers. Reference source
  • SCREEN Semiconductor Solutions — Supplies wafer cleaning equipment in the memory manufacturing chain. SCREEN cites HBM investment exposure; the SU-3400 specifications here are general wafer-cleaning capabilities. Reference source
  • SEMES — Manufactures thermal-compression bonders for NCF-based HBM stacking. Its June 2024 disclosure also describes hybrid-bonding development for processes beyond HBM4. Reference source
  • SUSS — Supplies temporary bonding and debonding systems for HBM wafer thinning. Its platforms also clean adhesive residues after the carrier is removed. Reference source
  • Tokyo Electron — Supplies temporary bonding and debonding tools for the thin silicon layers used in HBM, plus a permanent-bonding platform for 3D integration. Reference source
  • TOWA — Supplies molding equipment for stacked-memory packaging. Its HBM4 process announcement identifies a narrow-gap underfill technology and the target equipment series. Reference source
  • Yamaha Robotics (SHINKAWA) — Supplies SHINKAWA-series package bonders for thermo-compression assembly. Yamaha positions the FPB-1s NeoForce for TSV-based HBM applications. Reference source