Methodology
Supplier evidence, scoped research estimates and a date on every row.
Where the data comes from
This edition was researched on from supplier product pages, technical descriptions, company announcements, investor presentations and financial disclosures. Reuters and established business reporting supplement first-party evidence for disclosed relationships and development status. Each filled field links to dated sources. The role is our grouping of the documented product or process.
Counterpoint Research supplies the dated HBM revenue-share estimates. The period and denominator stay in each value; HBM revenue share is distinct from overall DRAM revenue share and from shipment share. Unimicron’s substrate design targets come from its roadmap reproduced in Meritz Research, table 4. A roadmap target is not production qualification.
How we verify
Every included record has at least three sourced fields beyond its name, URL and summary. Commercial suppliers have product and process evidence; CXMT has reported sample-development and partner evidence. A filled field must be supported by its linked sources. Combined fields retain all relevant citations. An empty cell means the value is not yet published. The access date records this review, not the original announcement date.
Compare the same thing
Reference stack capacity and layer count apply to the named memory product. SK hynix’s reference is HBM3E; Samsung’s and Micron’s references are HBM4. These are documented examples, not a complete portfolio or a statement of the largest orderable stack.
Manufacturing capacity, customer allocation and memory capacity are separate quantities. Capacity disclosures retain their announcement date, scope and status. Contract prices, lead times and allocation come from a live quote, so request one with your volume and date.
Qualification and coverage
Equipment, materials and packaging services are included where sources establish their role in the manufacturing chain. Each record names the HBM customer, generation or evaluation status exactly as its source states it.
CXMT’s Reuters-reported HBM sample development is included with unknown generation specifications and commercial status left empty. HBM4E samples and development roadmaps at the commercial memory makers retain those labels. Named AMD and NVIDIA relationships are sourced individually; Broadcom is named for TSMC’s CoWoS-based XPU integration, without inferring its memory supplier.
NCF is non-conductive film used during die stacking. MUF is mold underfill used for encapsulation; NAMICS’s LCMUF disclosure covers chip-to-interposer gaps. Temporary wafer-support adhesive, organic package substrates and CMP consumables serve other steps. A broad packaging application is not a disclosed HBM customer qualification.
Corrections
Vendors and readers can send corrections to hello@hbmsuppliers.com with a public source. We update the row and its verified date. Featured placement is paid and labelled; it never changes a row’s data or its position in the sorted table.
Reuse
The dataset is free to reuse under CC BY 4.0 with a link to hbmsuppliers.com. The licence covers our compilation; linked documents and product names retain their owners’ rights. Download it as CSV or JSON.
Field definitions
12 fields- Supply-chain role
- Editorial grouping of the documented product or process; groups are not interchangeable suppliers.
- Reference product / platform
- A named product, platform or material checked in the linked source; not an exhaustive catalogue.
- Process / service
- The manufacturing, packaging or test step explicitly described by the source.
- Published capability
- A product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
- HBM generations / scope
- Only generations explicitly documented in the cited source. Application or roadmap scope is labelled.
- Reference stack capacity GB
- Capacity of the named reference memory stack, not monthly output or a supplier maximum.
- Reference stack layers layers
- DRAM die count in the named reference stack. Future roadmap heights are excluded.
- Named platform / customer
- Only an explicitly disclosed platform relationship; designed-for statements are labelled.
- Supply-capacity disclosure
- Dated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
- Market share (scope and period)
- Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
- HBM base-die logic
- Disclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
- Named ecosystem partners
- Disclosed development or manufacturing partners; a partnership is not a customer supply contract.