HBM test systems and probe cards
Advantest and Teradyne supply memory test systems; FormFactor supplies the probe cards that contact the devices. Compare the test stage and interface before comparing the published speeds.
| Advantest | T5503HS21 | Automated memory-device testing1 | Up to 9 Gbps; 16,256 channels; timing accuracy ±45 ps1 | 2026-11-11 |
|---|---|---|---|---|
| FormFactor | HFTAP K32 on SmartMatrix1 | Wafer-level known-good-die testing with 3D MEMS probes1 | Up to 3.2 GHz / 6.4 Gbps; fine pitch down to 50 µm1 | 2026-11-11 |
| Teradyne | Magnum 7H1 | Base-die wafer test; pre/post-singulated stack test1 | Up to 4.5 Gbps; 9,216 digital pins and 2,560 power pins1 | 2026-11-11 |
Who tests the dies and assembled stacks?
Known-good-die screening, base-die test and stack test have different coverage requirements. A tester’s interface speed is not the memory stack’s rated bandwidth. Ask for the applicable direct-access or test interface, parallelism, thermal range and contact geometry for your device.
- Advantest — Supplies memory test equipment covering high-bandwidth memory devices. The reference tester specifies channel count, speed and timing accuracy. Reference source
- FormFactor — Supplies MEMS probe cards for known-good-die memory testing before package assembly. The HFTAP platform also tests devices used in HBM stacks. Reference source
- Teradyne — Supplies a tester for HBM base dies and stacks before and after singulation. Its published interface speed is a tester specification, measured differently from memory pin speed. Reference source
Dated capacity and expansion disclosures
- FormFactor: October 2026: opened Farmers Branch, Texas manufacturing facility for advanced probe cards; HBM-specific output not disclosed 2