HBM packaging and interposer services
TSMC, ASE, Amkor and SPIL document packaging services around HBM. TSMC also has an HBM4 base-die logic agreement with SK hynix. Compare assembly and interposer work separately from memory production.
| Amkor Technology | 2.5D/3D TSV packaging1 | TSV reveal; backside metallization; Cu micro-pillar plating1 | MEOL input: 300 mm wafers with pre-formed blind TSVs1 | 2026-11-11 |
|---|---|---|---|---|
| ASE | 2.5D/3D IC packaging; FOCoS1 | Silicon interposer with TSV; heterogeneous memory integration1 | Published interposer routing line/space: 0.4/0.4 µm1 | 2026-11-11 |
| SPIL | 2.5D FCBGA with HBM; FO-EB-T FCBGA with HBM1 | Fan-out embedded-bridge and TSV-enabled package integration1 | Annual report lists both embedded-bridge/TSV and 2.5D HBM packaging1 | 2026-11-11 |
| TSMC | CoWoS-S; CoWoS-R; CoWoS-L1 | Silicon or RDL interposer integration of logic and HBM1 | CoWoS-R uses an RDL interposer; in volume production since 20231 | 2026-11-11 |
Who integrates HBM with the processor?
Ask who supplies the interposer, who forms the vias, and who owns wafer thinning, assembly and final test. Amkor’s linked service begins with pre-formed TSVs. Ask for slot dates up front: TSMC planned to double CoWoS capacity in 2025 to meet AI demand.
- Amkor Technology — Processes TSV-bearing wafers and assembles advanced packages. Its service starts with pre-formed vias and includes reveal and backside metallization. Reference source
- ASE — Packages logic and HBM together using interposers and fan-out platforms. Its published specifications distinguish routing density from the number of memory stacks. Reference source
- SPIL — Provides HBM-integrated fan-out and 2.5D packaging services. Its annual report lists embedded-bridge and TSV-enabled integration alongside conventional package assembly. Reference source
- TSMC — Provides the interposer-based packaging that connects processors to HBM stacks. CoWoS is an integration service for the complete accelerator package. Reference source