HBMsuppliers

SK hynix

Makes HBM stacks for AI accelerators and led HBM revenue in Q2 2026. Its 12-layer HBM3E is in volume production, and its 12-layer 36GB HBM4 ships in NVIDIA Vera Rubin.

Memory

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Memory 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
HBM3E 12-layer reference stack 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
Advanced MR-MUF die stacking with TSV interconnects 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
HBM3E pin speed: 9.6 Gbps 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM3E; HBM4; HBM4E (samples shipped June 2026) 25
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
36 1
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
12 1
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
NVIDIA Vera Rubin (HBM4 demonstrated at TSMC OIP 2026) 7
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
October 2026 results: targets M15X maximum-capacity ramp by year-end 2026 to increase HBM4 output; output quantity undisclosed 6
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
50% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded) 3
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
HBM4: TSMC advanced logic process, under April 2024 collaboration agreement 4
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
TSMC: HBM4 base die and CoWoS integration collaboration 4

Sources

  1. SK hynix: 12-layer HBM3E volume production, 26 Sep 2024 accessed 2026-11-11
  2. SK hynix: HBM4 development and mass-production readiness, 12 Sep 2025 accessed 2026-11-11
  3. Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026 accessed 2026-11-11
  4. SK hynix: TSMC HBM4 base-die and CoWoS agreement, 19 Apr 2024 accessed 2026-11-11
  5. SK hynix: HBM4E sample shipments, 18 Jun 2026 accessed 2026-11-11
  6. SK hynix: third-quarter 2026 results and M15X ramp target, Oct 2026 accessed 2026-11-11
  7. SK hynix: HBM4 in NVIDIA Vera Rubin exhibition, Oct 2026 accessed 2026-11-11
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