HBMsuppliers

HANMI Semiconductor

Supplies thermal-compression bonders for stacked memory and HBM package inspection equipment. The listed product family comes from its equipment catalogue.

Bonding & TSV

Verified

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Bonding & TSV 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
TC Bonder 4.5 Griffin (June 2026 order) 2
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
Thermal-compression bonding for HBM 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
Catalogue also lists HBM 6-SIDE INSPECTION 1.0 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM4 (reported equipment order) 2
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
Not published
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
Not published
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
SK hynix (TC bonder supply contract) 2
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
Not published
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
Not published
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
Not published
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. HANMI: HBM TC bonder equipment catalogue accessed 2026-11-11
  2. Yonhap: Hanmi regulatory filing, SK hynix TC bonder order, 8 Jun 2026 accessed 2026-11-11
HBM bonding, TSV and wafer-processing equipment

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