Applied Materials
Supplies materials-processing equipment for DRAM and stacked-chip packaging. Its deposition platform fills vias and forms interconnects around the HBM stack.
Facts
Source per value- Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
- Bonding & TSV 1
- Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
- Nokota VMax 2; Kinex (with Besi) 12
- Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
- TSV/microbump copper plating; integrated die-to-wafer hybrid bonding 12
- Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
- Platform spans TSV filling and fine-pitch interconnect plating 1
- HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
- Not published
- Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
- Not published
- Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
- Not published
- Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
- Not published
- Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
- Not published
- Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
- Not published
- HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
- Not published
- Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
- Besi: co-developed Kinex hybrid bonding system 2
Sources
- Applied Materials: new DRAM and advanced-packaging systems, 25 Jun 2026 accessed 2026-11-11
- Applied Materials: Kinex integrated hybrid bonding system, 7 Oct 2025 accessed 2026-11-11
Related suppliers
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