HBMsuppliers

TOWA

Supplies molding equipment for stacked-memory packaging. Its HBM4 process announcement identifies a narrow-gap underfill technology and the target equipment series.

Bonding & TSV

Verified

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Bonding & TSV 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
CPM series (announced application) 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
Compression molding; ultra-narrow-gap mold underfill 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
Announced technology targets narrow gaps in HBM4 stacks 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM4 (announced process target) 1
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
Not published
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
Not published
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
Not published
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
Not published
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
Not published
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
Not published
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. TOWA: HBM4 packaging technology announcement, 21 Mar 2025 accessed 2026-11-11
HBM bonding, TSV and wafer-processing equipment

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