HBMsuppliers

Unimicron

Manufactures FC-BGA package substrates in the wider accelerator packaging chain. The recorded design rules are roadmap targets reproduced in Meritz research, not proof of HBM qualification.

Substrates & materials

Verified

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Substrates & materials 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
FC-BGA package substrates 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
Build-up wiring and core-layer interconnects 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
2026 roadmap target: 150 × 150 mm body size and 5/7 µm build-up line/space 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
Not published
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
Not published
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
Not published
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
Not published
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
Not published
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
Not published
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
Not published
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. Meritz Research: Unimicron FC-BGA roadmap, table 4, page 4, 16 Jun 2026 accessed 2026-11-11
HBM substrates and packaging materials
  • Ajinomoto Fine-TechnoAjinomoto Build-up Film (ABF)
  • AT&SHigh-end IC substrates; Kulim ABF substrates
  • EntegrisAdvanced-packaging CMP pads, slurries and post-CMP cleaning solutions
  • HenkelLOCTITE ECCOBOND NCF 200 series; NCP 5209

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