HBMsuppliers

TSMC

Provides the interposer-based packaging that connects processors to HBM stacks. CoWoS is an integration service for the complete accelerator package.

Packaging

Verified

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Facts

Source per value
Supply-chain roleEditorial grouping of the documented product or process; groups are not interchangeable suppliers.
Packaging 1
Reference product / platformA named product, platform or material checked in the linked source; not an exhaustive catalogue.
CoWoS-S; CoWoS-R; CoWoS-L 1
Process / serviceThe manufacturing, packaging or test step explicitly described by the source.
Silicon or RDL interposer integration of logic and HBM 1
Published capabilityA product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.
CoWoS-R uses an RDL interposer; in volume production since 2023 1
HBM generations / scopeOnly generations explicitly documented in the cited source. Application or roadmap scope is labelled.
HBM4 (SK hynix base-die collaboration) 2
Reference stack capacity GBCapacity of the named reference memory stack, not monthly output or a supplier maximum.
Not published
Reference stack layers layersDRAM die count in the named reference stack. Future roadmap heights are excluded.
Not published
Named platform / customerOnly an explicitly disclosed platform relationship; designed-for statements are labelled.
SK hynix (HBM4 base-die collaboration); Broadcom (CoWoS-based 3.5D XPU) 23
Supply-capacity disclosureDated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.
April 2025 earnings call: plan to double CoWoS capacity in 2025 4
Market share (scope and period)Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.
Not published
HBM base-die logicDisclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.
HBM4 base-die logic for SK hynix: advanced foundry process under April 2024 agreement 2
Named ecosystem partnersDisclosed development or manufacturing partners; a partnership is not a customer supply contract.
Not published

Sources

  1. TSMC: CoWoS advanced packaging platform accessed 2026-11-11
  2. SK hynix: TSMC HBM4 base-die and CoWoS agreement, 19 Apr 2024 accessed 2026-11-11
  3. Broadcom: 3.5D XPU using TSMC CoWoS, 5 Dec 2024 accessed 2026-11-11
  4. TSMC: first-quarter 2025 earnings-call transcript, 17 Apr 2025 accessed 2026-11-11
HBM packaging and interposer services

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