{ "name": "HBM suppliers", "url": "https://hbmsuppliers.com/", "license": "CC BY 4.0", "cite": "HBM Suppliers, https://hbmsuppliers.com/", "updated": "2026-11-11", "fields": [ { "key": "role", "label": "Supply-chain role", "type": "enum", "description": "Editorial grouping of the documented product or process; groups are not interchangeable suppliers.", "filterable": true, "sortable": true, "enumValues": [ "Memory", "Packaging", "Bonding & TSV", "Test", "Inspection", "Substrates & materials" ] }, { "key": "offer", "label": "Reference product / platform", "type": "string", "description": "A named product, platform or material checked in the linked source; not an exhaustive catalogue.", "sortable": true }, { "key": "process", "label": "Process / service", "type": "string", "description": "The manufacturing, packaging or test step explicitly described by the source.", "sortable": true }, { "key": "capability", "label": "Published capability", "type": "string", "description": "A product-specific capability or specification. Test speeds, defect sizes and memory bandwidth are different measures.", "sortable": true }, { "key": "generations", "label": "HBM generations / scope", "type": "string", "description": "Only generations explicitly documented in the cited source. Application or roadmap scope is labelled.", "sortable": true }, { "key": "stack_gb", "label": "Reference stack capacity", "type": "number", "unit": "GB", "description": "Capacity of the named reference memory stack, not monthly output or a supplier maximum.", "sortable": true }, { "key": "stack_layers", "label": "Reference stack layers", "type": "number", "unit": "layers", "description": "DRAM die count in the named reference stack. Future roadmap heights are excluded.", "sortable": true }, { "key": "customers", "label": "Named platform / customer", "type": "string", "description": "Only an explicitly disclosed platform relationship; designed-for statements are labelled.", "sortable": true }, { "key": "supply_capacity", "label": "Supply-capacity disclosure", "type": "string", "description": "Dated public production-capacity disclosure or plan. Not available allocation, inventory or a lead-time estimate.", "sortable": true }, { "key": "market_share", "label": "Market share (scope and period)", "type": "string", "description": "Published research or filing estimate with its market, metric and period. Rounded shares need not sum to 100%; not a current allocation measure.", "sortable": true }, { "key": "base_die_logic", "label": "HBM base-die logic", "type": "string", "description": "Disclosed base-die foundry or process for a named generation. Collaboration announcements retain their status and date.", "sortable": true }, { "key": "ecosystem_partners", "label": "Named ecosystem partners", "type": "string", "description": "Disclosed development or manufacturing partners; a partnership is not a customer supply contract.", "sortable": true } ], "records": [ { "id": "acm-research", "name": "ACM Research", "url": "https://www.acmr.com/", "summary": "Supplies electrochemical plating systems for TSVs, interposers and wafer-level packaging, covering copper, nickel, tin-silver and gold plating.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "Ultra ECP 3d; Ultra ECP ap", "process": "TSV fill and interconnect metal plating for 3D integration", "capability": "Platform covers Cu, Ni, SnAg and gold plating for vias, pillars, bumps and RDL", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.acmr.com/electrochemical-plating/", "title": "ACM Research: Ultra ECP electrochemical plating portfolio", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "advantest", "name": "Advantest", "url": "https://www.advantest.com/", "summary": "Supplies memory test equipment covering high-bandwidth memory devices. The reference tester specifies channel count, speed and timing accuracy.", "tags": [ "Test" ], "fields": { "role": "Test", "offer": "T5503HS2", "process": "Automated memory-device testing", "capability": "Up to 9 Gbps; 16,256 channels; timing accuracy ±45 ps", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.advantest.com/en/products/semiconductor-test-system/memory/t5503hs2/", "title": "Advantest: T5503HS2 memory test system", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "ajinomoto-fine-techno", "name": "Ajinomoto Fine-Techno", "url": "https://www.aft-website.com/en/", "summary": "Supplies the insulating build-up film used between copper wiring layers in semiconductor package substrates. It is a substrate-material supplier in the wider packaging chain.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Ajinomoto Build-up Film (ABF)", "process": "Interlayer insulation for build-up package substrates", "capability": "Film enables simultaneous processing on both substrate sides", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.ajinomoto.co.jp/company/en/presscenter/press/detail/g2016_04_13.html", "title": "Ajinomoto: ABF material and manufacturing description, 13 Apr 2016", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "amkor", "name": "Amkor Technology", "url": "https://amkor.com/", "summary": "Processes TSV-bearing wafers and assembles advanced packages. Its service starts with pre-formed vias and includes reveal and backside metallization.", "tags": [ "Packaging" ], "fields": { "role": "Packaging", "offer": "2.5D/3D TSV packaging", "process": "TSV reveal; backside metallization; Cu micro-pillar plating", "capability": "MEOL input: 300 mm wafers with pre-formed blind TSVs", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://amkor.com/technology/25d-3d-tsv/", "title": "Amkor: 2.5D/3D TSV packaging", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "applied-materials", "name": "Applied Materials", "url": "https://www.appliedmaterials.com/", "summary": "Supplies materials-processing equipment for DRAM and stacked-chip packaging. Its deposition platform fills vias and forms interconnects around the HBM stack.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "Nokota VMax 2; Kinex (with Besi)", "process": "TSV/microbump copper plating; integrated die-to-wafer hybrid bonding", "capability": "Platform spans TSV filling and fine-pitch interconnect plating", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": "Besi: co-developed Kinex hybrid bonding system" }, "sources": [ { "url": "https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-introduces-new-systems-accelerate-dram-and", "title": "Applied Materials: new DRAM and advanced-packaging systems, 25 Jun 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-next-gen-chipmaking-products/", "title": "Applied Materials: Kinex integrated hybrid bonding system, 7 Oct 2025", "accessed": "2026-11-11", "fields": [ "offer", "process", "ecosystem_partners" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "ase", "name": "ASE", "url": "https://ase.aseglobal.com/", "summary": "Packages logic and HBM together using interposers and fan-out platforms. Its published specifications distinguish routing density from the number of memory stacks.", "tags": [ "Packaging" ], "fields": { "role": "Packaging", "offer": "2.5D/3D IC packaging; FOCoS", "process": "Silicon interposer with TSV; heterogeneous memory integration", "capability": "Published interposer routing line/space: 0.4/0.4 µm", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://ase.aseglobal.com/3d-ic-packaging/", "title": "ASE: 2.5D and 3D IC packaging", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "asmpt", "name": "ASMPT", "url": "https://www.asmpt.com/", "summary": "Supplies thermo-compression bonding equipment for heterogeneous integration. Its HBM-specific work includes a fluxless process using active oxide removal.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "FIREBIRD TCB; AOR TCB", "process": "Thermo-compression bonding; active oxide removal", "capability": "FIREBIRD placement accuracy: ±2.0 µm", "generations": "HBM3E 12H (installed tools); HBM4 12H (low-volume manufacturing)", "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.asmpt.com/en/innovation/thermo-compression-bonding/", "title": "ASMPT: FIREBIRD TCB platform", "accessed": "2026-11-11", "fields": [ "role", "capability", "offer", "process" ] }, { "url": "https://semi.asmpt.com/en/news-center/press-releases/thermocompression-bonding-with-active-oxide-removal/", "title": "ASMPT: fluxless AOR TCB for HBM, 28 May 2026", "accessed": "2026-11-11", "fields": [ "offer", "process" ] }, { "url": "https://www.asmpt.com/site/assets/files/81363/e0522_press_release_2025_q2_results.pdf", "title": "ASMPT: Q2 2025 results, HBM3E and HBM4 tool installations", "accessed": "2026-11-11", "fields": [ "generations" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "at-s", "name": "AT&S", "url": "https://ats.net/en/", "summary": "Manufactures high-end IC package substrates for high-performance processors. Its Kulim, Malaysia plant, backed by a US$250 million IFC loan, supplies AMD data-center processors.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "High-end IC substrates; Kulim ABF substrates", "process": "FCBGA/FCLGA substrate fabrication for high-performance processors", "capability": "Kulim technology portfolio includes up to 26 layers and 5 µm line/space", "generations": null, "stack_gb": null, "stack_layers": null, "customers": "AMD (data-center processor substrates; HBM generation not disclosed)", "supply_capacity": "March 2025: US$250 million IFC loan signed to support Kulim substrate plant expansion; HBM-specific output undisclosed", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://ats.net/unternehmen/ats-worldwide/", "title": "AT&S: Kulim manufacturing technologies", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://ats.net/en/ir-news/ats-and-ifc-sign-sustainability-linked-loan-agreement-to-finance-integrated-circuit-substrate-plant-in-malaysia-news-with-additional-features/", "title": "AT&S: IFC financing and AMD substrate relationship, 13 Mar 2025", "accessed": "2026-11-11", "fields": [ "role", "offer", "customers", "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "besi", "name": "Besi", "url": "https://www.besi.com/", "summary": "Supplies hybrid-bonding equipment for dense interconnects and 3D integration. Its Q1 2026 results report hybrid-bonding evaluation tools for HBM.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "Datacon 8800 CHAMEO ultra plus AC", "process": "Hybrid bonding with optical alignment", "capability": "Platform targets high-density interconnects and 3D integration", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": "Applied Materials: co-developed Kinex integrated die-to-wafer hybrid bonding system" }, "sources": [ { "url": "https://www.besi.com/products-technology/product-details/productgroup/hybrid-bonding/", "title": "Besi: hybrid bonding product family", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://live.euronext.com/sites/default/files/company_press_releases/attachments/2026/04/23/Connect_q1-2026.pdf", "title": "Besi: Q1 2026 results, HBM evaluation tools", "accessed": "2026-11-11" }, { "url": "https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-next-gen-chipmaking-products/", "title": "Applied Materials: Kinex hybrid bonder co-developed with Besi, 7 Oct 2025", "accessed": "2026-11-11", "fields": [ "ecosystem_partners" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "camtek", "name": "Camtek", "url": "https://www.camtek.com/", "summary": "Supplies optical inspection and metrology equipment for HBM, chiplets and hybrid bonding. Its Hawk platform measures dense bump arrays.", "tags": [ "Inspection" ], "fields": { "role": "Inspection", "offer": "Hawk", "process": "Wafer defect inspection; bump and overlay metrology", "capability": "Defect sensitivity down to 0.1 µm; more than 500 million bumps per wafer", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.camtek.com/products/hawk/", "title": "Camtek: Hawk inspection and metrology platform", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "cxmt", "name": "CXMT", "url": "https://www.cxmt.com/", "summary": "Develops HBM sample chips with Tongfu Microelectronics, according to Reuters reporting in May 2024. Track it as the emerging Chinese HBM source.", "tags": [ "Memory" ], "fields": { "role": "Memory", "offer": "HBM sample chips (reported May 2024)", "process": null, "capability": "Samples reportedly shown to clients", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": "Tongfu Microelectronics (Reuters-reported HBM sample development)" }, "sources": [ { "url": "https://news-static.webullfintech.com/us/news-html/20240515/10750654415635456.html", "title": "Reuters: Chinese firms develop HBM samples, 15 May 2024 (syndicated by Webull)", "accessed": "2026-11-11", "fields": [ "role", "offer", "capability", "ecosystem_partners" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "disco", "name": "DISCO", "url": "https://www.disco.co.jp/eg/", "summary": "Supplies grinding and polishing equipment for thin-wafer processing. Its DGP8761 grinds and stress-relief polishes 200 mm and 300 mm wafers to 25 µm or less.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "DGP8761 grinder/polisher", "process": "Backgrinding followed by stress-relief polishing", "capability": "Supports 200 mm and 300 mm wafers; finish thickness 25 µm or less", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://disco.co.jp/jp/products/polisher_etcher/dgp8761.html", "title": "DISCO: DGP8761 specifications", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "ebara", "name": "EBARA", "url": "https://www.ebara.com/", "summary": "Supplies CMP and plating systems used in semiconductor processing. Ebara targets planarization demand from HBM and CoWoS packaging.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "F-REX300X CMP; UFP-AS plating", "process": "Chemical mechanical planarization; bump, RDL and via electroplating", "capability": "F-REX300X: 300 mm wafers; UFP-AS: panels up to 600 × 600 mm", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.ebara.com/content/dam/ebara/grand-masters/entities/en/products/precision-pump/pdf/80002E_26_18.pdf", "title": "EBARA: F-REX and UFP technical catalogue, pages 20–21", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://ebara.com/ir/library/earnings/briefings-documents/__icsFiles/afieldfile/2025/02/25/250214_QA_J.pdf", "title": "EBARA: FY2024 earnings Q&A, HBM and CoWoS CMP opportunities, 14 Feb 2025", "accessed": "2026-11-11", "fields": [ "role" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "entegris", "name": "Entegris", "url": "https://www.entegris.com/", "summary": "Supplies CMP consumables and contamination-control materials for advanced packaging. Entegris also documents filtration and purification research for HBM manufacturing.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Advanced-packaging CMP pads, slurries and post-CMP cleaning solutions", "process": "Planarization consumables; residue removal and slurry filtration", "capability": "Integrated chemistry, pads, cleaning and process monitoring for surface planarity and defect control", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.entegris.com/en/home/our-science/by-industry/microelectronics/semiconductor/advanced-packaging/cmp.html", "title": "Entegris: advanced-packaging CMP and cleaning portfolio", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://www.entegris.com/en/home/about-us/events/smc-korea-2025.html", "title": "Entegris: material contamination and filtration in HBM manufacturing, SMC Korea 2025", "accessed": "2026-11-11", "fields": [ "role" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "ev-group", "name": "EV Group", "url": "https://www.evgroup.com/", "summary": "Supplies temporary wafer bonding equipment that supports thin-wafer handling and backside processing. The open adhesive platform supports several carrier materials.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "EVG850 TB", "process": "Adhesive coating; baking; alignment; temporary carrier bonding", "capability": "Substrate size: up to 300 mm; silicon, glass or sapphire carriers", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems/evg850-tb", "title": "EV Group: EVG850 TB technical data", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "formfactor", "name": "FormFactor", "url": "https://www.formfactor.com/", "summary": "Supplies MEMS probe cards for known-good-die memory testing before package assembly. The HFTAP platform also tests devices used in HBM stacks.", "tags": [ "Test" ], "fields": { "role": "Test", "offer": "HFTAP K32 on SmartMatrix", "process": "Wafer-level known-good-die testing with 3D MEMS probes", "capability": "Up to 3.2 GHz / 6.4 Gbps; fine pitch down to 50 µm", "generations": "HBM3 (listed application)", "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": "October 2026: opened Farmers Branch, Texas manufacturing facility for advanced probe cards; HBM-specific output not disclosed", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.formfactor.com/product/probe-cards/dram/hftap-series/", "title": "FormFactor: HFTAP series probe cards", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations" ] }, { "url": "https://investors.formfactor.com/news-releases/news-release-details/formfactor-opens-farmers-branch-manufacturing-facility-support", "title": "FormFactor: Farmers Branch manufacturing facility opening, 22 Oct 2026", "accessed": "2026-11-11", "fields": [ "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "hanmi", "name": "HANMI Semiconductor", "url": "https://www.hanmisemi.com/en/", "summary": "Supplies thermal-compression bonders for stacked memory and HBM package inspection equipment. The listed product family comes from its equipment catalogue.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "TC Bonder 4.5 Griffin (June 2026 order)", "process": "Thermal-compression bonding for HBM", "capability": "Catalogue also lists HBM 6-SIDE INSPECTION 1.0", "generations": "HBM4 (reported equipment order)", "stack_gb": null, "stack_layers": null, "customers": "SK hynix (TC bonder supply contract)", "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.hanmisemi.com/en/product/sub_view1.html", "title": "HANMI: HBM TC bonder equipment catalogue", "accessed": "2026-11-11", "fields": [ "role", "process", "capability" ] }, { "url": "https://en.yna.co.kr/view/AEN20260608012500320", "title": "Yonhap: Hanmi regulatory filing, SK hynix TC bonder order, 8 Jun 2026", "accessed": "2026-11-11", "fields": [ "offer", "generations", "customers" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "hanwha-semitech", "name": "Hanwha Semitech", "url": "https://www.hanwha.com/companies/hanwha-semitech.do", "summary": "Supplies thermo-compression bonders for HBM manufacturing, with TC bonder contracts at SK hynix. Its SHB2 Nano hybrid bonder was announced for customer performance testing in H1 2026.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "SFM5-Expert TC bonder; SHB2 Nano (evaluation-stage hybrid bonder)", "process": "Thermo-compression die stacking; hybrid bonding development", "capability": "TC bonders in mass production; hybrid system announced for customer performance testing in H1 2026", "generations": null, "stack_gb": null, "stack_layers": null, "customers": "SK hynix (TC bonder contracts reported March 2025)", "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.hanwha.com/companies/hanwha-semitech.do", "title": "Hanwha: Semitech equipment and SFM5-Expert catalogue", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://www.hanwha.com/assets/download/Hanwha-Profile-2025.pdf", "title": "Hanwha: 2025 corporate profile, HBM TC equipment", "accessed": "2026-11-11", "fields": [ "role", "process" ] }, { "url": "https://www.koreaherald.com/article/10682137", "title": "Korea Herald: Hanwha SHB2 Nano announced for customer tests, 25 Feb 2026", "accessed": "2026-11-11", "fields": [ "offer", "process", "capability" ] }, { "url": "https://biz.chosun.com/en/en-it/2025/03/27/WPHRQXYNFBAYRB4YAGAXQHYWAA/", "title": "ChosunBiz: Hanwha TC bonder contracts with SK hynix, 27 Mar 2025", "accessed": "2026-11-11", "fields": [ "customers" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "henkel", "name": "Henkel", "url": "https://www.henkel.com/", "summary": "Supplies non-conductive film and paste for fine-pitch memory and 3D TSV assemblies: the materials that protect bumps during thermo-compression bonding.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "LOCTITE ECCOBOND NCF 200 series; NCP 5209", "process": "Bump protection and underfill curing during thermo-compression bonding", "capability": "Films target fine-pitch, narrow-gap interconnects in memory and 3D TSV stacks", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.henkel.com/press-and-media/press-releases-and-kits/2019-09-05-5g-and-automotive-adas-enabling-henkel-materials-featured-at-ectc-2019-941050", "title": "Henkel: NCF/NCP advanced-packaging materials, ECTC 2019", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "ibiden", "name": "IBIDEN", "url": "https://www.ibiden.com/", "summary": "Supplies IC package substrates for AI servers and networking. Its new Ono Plant began sequential mass production of advanced substrates from October 2025.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Advanced IC package substrates", "process": "Automated package-substrate production at Ono Plant", "capability": "Ono Plant: sequential mass-production start scheduled from October 2025, primarily for AI server substrates", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": "October 2025 opening notice: Ono Plant completed January 2025; sequential mass production scheduled from October 2025; HBM-specific output undisclosed", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.ibiden.com/company/2025/10/notice-regarding-the-opening-ceremony-of-the-ono-plant.html", "title": "IBIDEN: Ono Plant opening and production scope, Oct 2025", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "kla", "name": "KLA", "url": "https://www.kla.com/", "summary": "Supplies inspection and metrology for advanced wafer-level packaging. Kronos and ICOS tools cover inline wafer inspection plus post-dicing inspection and sorting.", "tags": [ "Inspection" ], "fields": { "role": "Inspection", "offer": "Kronos 1190; ICOS F160XP", "process": "Inline wafer inspection; post-dicing inspection and sorting", "capability": "Kronos uses high-resolution optics for dense packaging patterns", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://ir.kla.com/news-events/press-releases/detail/9/kla-announces-enhanced-portfolio-of-systems-for-advanced", "title": "KLA: advanced-packaging inspection systems, 21 Sep 2020", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://ir.kla.com/sec-filings/all-sec-filings/content/0000319201-26-000016/0000319201-26-000016.pdf", "title": "KLA: Form 10-Q for quarter ended 31 Mar 2026, HBM-driven DRAM investment", "accessed": "2026-11-11" } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "lam-research", "name": "Lam Research", "url": "https://www.lamresearch.com/", "summary": "Supplies TSV etch and plating equipment used in HBM manufacturing. The SABRE family also supports bumping and redistribution layers.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "Syndion TSV etch; SABRE 3D plating", "process": "TSV etch; copper electrochemical deposition", "capability": "SABRE 3D supports Cu/SnAg and Ni/Au microbumps", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.lamresearch.com/product/sabre-3d/", "title": "Lam Research: SABRE 3D product family", "accessed": "2026-11-11", "fields": [ "role", "capability" ] }, { "url": "https://filecache.investorroom.com/mr5ir_lamresearch2/1435/Lam%20Research%202025%20Investor%20Day%20FINAL.pdf", "title": "Lam Research: 2025 Investor Day, HBM process tools", "accessed": "2026-11-11", "fields": [ "offer", "process" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "micron", "name": "Micron Technology", "url": "https://www.micron.com/", "summary": "Makes HBM for accelerator platforms. Its HBM4 release states volume shipments and names the NVIDIA platform the memory is designed for.", "tags": [ "Memory" ], "fields": { "role": "Memory", "offer": "HBM4 36GB 12H reference stack", "process": "HBM4 stacked memory for accelerator integration", "capability": "HBM4 bandwidth: greater than 2.8 TB/s per stack", "generations": "HBM3E; HBM4; HBM4E (development; volume production expected in calendar 2027)", "stack_gb": 36, "stack_layers": 12, "customers": "NVIDIA Vera Rubin (designed for)", "supply_capacity": "January 2025 plan: approximately US$7 billion Singapore HBM packaging investment; meaningful capacity expansion from calendar 2027", "market_share": "18% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded)", "base_die_logic": "HBM4: in-house advanced CMOS base die", "ecosystem_partners": null }, "sources": [ { "url": "https://micron.gcs-web.com/news-releases/news-release-details/micron-high-volume-production-hbm4-designed-nvidia-vera-rubin", "title": "Micron: high-volume HBM4 for NVIDIA Vera Rubin, 16 Mar 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations", "stack_gb", "stack_layers", "customers" ] }, { "url": "https://counterpointresearch.com/en/insights/global-dram-and-hbm-market-share", "title": "Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026", "accessed": "2026-11-11", "fields": [ "market_share" ] }, { "url": "https://investors.micron.com/financials/quarterly-results/", "title": "Micron: fiscal 2026 quarterly results, HBM4E development outlook", "accessed": "2026-11-11", "fields": [ "generations" ] }, { "url": "https://investors.micron.com/static-files/5ea95475-639b-4cfc-91fd-b9b4a2bb5e63", "title": "Micron: fiscal Q4 2025 prepared remarks, HBM4 base die", "accessed": "2026-11-11", "fields": [ "base_die_logic" ] }, { "url": "https://investors.micron.com/news/press-release/2025/Micron-Breaks-Ground-on-New-HBM-Advanced-Packaging-Facility-in-Singapore-01-08-2025/default.aspx", "title": "Micron: Singapore HBM advanced-packaging groundbreaking, 8 Jan 2025", "accessed": "2026-11-11", "fields": [ "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "namics", "name": "NAMICS", "url": "https://www.namics.co.jp/en/", "summary": "Supplies liquid compression mold underfill for advanced semiconductor packages. Its LCMUF encapsulates interposer-to-chip gaps and the chip periphery in a single molding step.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Liquid Compression Mold Underfill (LCMUF)", "process": "Single-step compression molding of interposer-to-chip gaps and chip periphery", "capability": "Commercialized for mass production; resin/filler design balances flowability and warpage", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": "Resonac (material evaluation during LCMUF development)" }, "sources": [ { "url": "https://www.namics.co.jp/en/news/1873/", "title": "NAMICS: LCMUF commercialization and JIEP award, 18 Jun 2024", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "ecosystem_partners" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "onto-innovation", "name": "Onto Innovation", "url": "https://ontoinnovation.com/", "summary": "Supplies inspection and metrology for HBM packaging. Its Dragonfly release reports selection by an unnamed memory manufacturer for an HBM4 ramp.", "tags": [ "Inspection" ], "fields": { "role": "Inspection", "offer": "Dragonfly G5; 3Di", "process": "2D defect inspection and 3D metrology", "capability": "Dragonfly G5 detects defects as small as 150 nm", "generations": "HBM4 (customer ramp application)", "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://investors.ontoinnovation.com/news/news-details/2026/Onto-Innovation-Launches-Dragonfly-G5-Inspection-System/default.aspx", "title": "Onto Innovation: Dragonfly G5 launch, 16 Mar 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "resonac", "name": "Resonac", "url": "https://www.resonac.com/", "summary": "Supplies non-conductive film for connecting and stacking HBM dies. Its disclosed expansion plan covers both film and thermal-interface materials.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Non-conductive film (NCF); thermal conductive sheet (TIM)", "process": "NCF bonding and stacking of multilayer HBM", "capability": "NCF connects stacked HBM layers; TIM supports heat transfer", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": "2024 plan: expand NCF/TIM capacity to 3.5–5× then-current level", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://eu.resonac.com/2903_24/", "title": "Resonac: AI-chip materials capacity plan, 29 Mar 2024", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "samsung", "name": "Samsung Electronics", "url": "https://semiconductor.samsung.com/", "summary": "Makes HBM memory and its own 4 nm logic base dies. Its commercial HBM4 runs at 11.7 Gbps per pin, and it is AMD's primary HBM3E partner for Instinct MI350X and MI355X.", "tags": [ "Memory" ], "fields": { "role": "Memory", "offer": "HBM4 12-layer reference stack", "process": "1c DRAM with 4 nm logic base die; low-voltage TSV", "capability": "HBM4 bandwidth: up to 3.3 TB/s per stack", "generations": "HBM3E; HBM4; HBM4E (samples shipped June 2026)", "stack_gb": 36, "stack_layers": 12, "customers": "AMD Instinct MI350X/MI355X (primary HBM3E partner); MI455X (HBM4 supply collaboration under March 2026 MOU)", "supply_capacity": "October 2026 results: HBM4 sales scaled up; Q4 plan to increase HBM supply and sales; no wafer-output figure disclosed", "market_share": "33% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded)", "base_die_logic": "HBM4 and HBM4E: Samsung Foundry 4 nm logic base die", "ecosystem_partners": null }, "sources": [ { "url": "https://news.samsung.com/global/samsung-ships-industry-first-commercial-hbm4-with-ultimate-performance-for-ai-computing", "title": "Samsung: commercial HBM4 shipments, 12 Feb 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations", "stack_gb", "stack_layers" ] }, { "url": "https://counterpointresearch.com/en/insights/global-dram-and-hbm-market-share", "title": "Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026", "accessed": "2026-11-11", "fields": [ "market_share" ] }, { "url": "https://news.samsung.com/uk/samsung-begins-shipment-of-industry-first-hbm4e-samples", "title": "Samsung: HBM4E samples and base-die process, 1 Jun 2026", "accessed": "2026-11-11", "fields": [ "generations", "base_die_logic" ] }, { "url": "https://news.samsung.com/ca/samsung-and-amd-expand-strategic-collaboration-on-next-generation-ai-memory-solutions", "title": "Samsung and AMD: memory collaboration and HBM4 MOU, Mar 2026", "accessed": "2026-11-11", "fields": [ "customers" ] }, { "url": "https://news.samsung.com/global/samsung-electronics-announces-third-quarter-2026-results", "title": "Samsung: third-quarter 2026 results and HBM outlook, 29 Oct 2026", "accessed": "2026-11-11", "fields": [ "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "screen", "name": "SCREEN Semiconductor Solutions", "url": "https://www.screen.co.jp/spe/en/", "summary": "Supplies wafer cleaning equipment in the memory manufacturing chain. SCREEN cites HBM investment exposure; the SU-3400 specifications here are general wafer-cleaning capabilities.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "SU-3400 single-wafer cleaner", "process": "Particle removal in wafer wet-cleaning steps", "capability": "Single-wafer cleaning platform for advanced logic and memory processing", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.screen.co.jp/en/news/NR221207E", "title": "SCREEN: SU-3400 single-wafer cleaner launch, 7 Dec 2022", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://hdjp-corporateweb-files.screen.co.jp/5017/9359/6740/FY2027Q2_FAQ_E.pdf", "title": "SCREEN: FY2027/03 Q2 Q&A, HBM exposure, 2 Nov 2026", "accessed": "2026-11-11", "fields": [ "role" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "semes", "name": "SEMES", "url": "https://www.semes.com/en/", "summary": "Manufactures thermal-compression bonders for NCF-based HBM stacking. Its June 2024 disclosure also describes hybrid-bonding development for processes beyond HBM4.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "HBM Thermal Compression Bonder", "process": "Heat/pressure alignment and vertical stacking of TSV-equipped chips", "capability": "NCF-method stacking with alignment control under high bonding loads", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.semes.com/en/media/newsroom/detail/123", "title": "SEMES: HBM bonder mass production and hybrid R&D, 3 Jun 2024", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "shinko", "name": "Shinko Electric Industries", "url": "https://www.shinko.co.jp/english/", "summary": "Develops i-THOP organic interposer substrates for heterogeneous integration including HBM. The supplier labels this platform under development.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "i-THOP 2.3D package substrate (under development)", "process": "Organic thin-film interposer integrated with build-up substrate; chip-last assembly", "capability": "Published design rules: 40 µm flip-chip pad pitch; 2/2 µm line/space", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.shinko.co.jp/english/product/docs/ithop_EN.pdf", "title": "Shinko: i-THOP technical sheet, under-development platform", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "sk-hynix", "name": "SK hynix", "url": "https://www.skhynix.com/", "summary": "Makes HBM stacks for AI accelerators and led HBM revenue in Q2 2026. Its 12-layer HBM3E is in volume production, and its 12-layer 36GB HBM4 ships in NVIDIA Vera Rubin.", "tags": [ "Memory" ], "fields": { "role": "Memory", "offer": "HBM3E 12-layer reference stack", "process": "Advanced MR-MUF die stacking with TSV interconnects", "capability": "HBM3E pin speed: 9.6 Gbps", "generations": "HBM3E; HBM4; HBM4E (samples shipped June 2026)", "stack_gb": 36, "stack_layers": 12, "customers": "NVIDIA Vera Rubin (HBM4 demonstrated at TSMC OIP 2026)", "supply_capacity": "October 2026 results: targets M15X maximum-capacity ramp by year-end 2026 to increase HBM4 output; output quantity undisclosed", "market_share": "50% of global HBM revenue, Q2 2026; Counterpoint Research estimate (rounded)", "base_die_logic": "HBM4: TSMC advanced logic process, under April 2024 collaboration agreement", "ecosystem_partners": "TSMC: HBM4 base die and CoWoS integration collaboration" }, "sources": [ { "url": "https://news.skhynix.com/en/sk-hynix-begins-volume-production-of-the-world-first-12-layer-hbm3e/", "title": "SK hynix: 12-layer HBM3E volume production, 26 Sep 2024", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "stack_gb", "stack_layers" ] }, { "url": "https://news.skhynix.com/en/sk-hynix-completes-worlds-first-hbm4-development-and-readies-mass-production/", "title": "SK hynix: HBM4 development and mass-production readiness, 12 Sep 2025", "accessed": "2026-11-11", "fields": [ "generations" ] }, { "url": "https://counterpointresearch.com/en/insights/global-dram-and-hbm-market-share", "title": "Counterpoint Research: quarterly DRAM and HBM revenue shares, Q2 2026", "accessed": "2026-11-11", "fields": [ "market_share" ] }, { "url": "https://news.skhynix.com/en/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership/", "title": "SK hynix: TSMC HBM4 base-die and CoWoS agreement, 19 Apr 2024", "accessed": "2026-11-11", "fields": [ "base_die_logic", "ecosystem_partners" ] }, { "url": "https://news.skhynix.com/en/sk-hynix-ships-samples-of-12-layer-next-gen-hbm4e-2/", "title": "SK hynix: HBM4E sample shipments, 18 Jun 2026", "accessed": "2026-11-11", "fields": [ "generations" ] }, { "url": "https://news.skhynix.com/en/q3-2026-business-results/", "title": "SK hynix: third-quarter 2026 results and M15X ramp target, Oct 2026", "accessed": "2026-11-11", "fields": [ "supply_capacity" ] }, { "url": "https://news.skhynix.com/en/tsmc-oip-conference-2026/", "title": "SK hynix: HBM4 in NVIDIA Vera Rubin exhibition, Oct 2026", "accessed": "2026-11-11", "fields": [ "customers" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "spil", "name": "SPIL", "url": "https://www.spil.com.tw/", "summary": "Provides HBM-integrated fan-out and 2.5D packaging services. Its annual report lists embedded-bridge and TSV-enabled integration alongside conventional package assembly.", "tags": [ "Packaging" ], "fields": { "role": "Packaging", "offer": "2.5D FCBGA with HBM; FO-EB-T FCBGA with HBM", "process": "Fan-out embedded-bridge and TSV-enabled package integration", "capability": "Annual report lists both embedded-bridge/TSV and 2.5D HBM packaging", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.spil.com.tw/Files/reports/Annual%20Report/111%E5%B9%B4%E4%B8%AD%E6%96%87%E5%B9%B4%E5%A0%B1PDF%E6%AA%94.pdf", "title": "SPIL: 2022 annual report, operating services, page 61", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "sumitomo-bakelite", "name": "Sumitomo Bakelite", "url": "https://www.sumibe.co.jp/english/", "summary": "Supplies mold-underfill and granular encapsulation materials for advanced semiconductor packaging. Its semiconductor materials disclosures include HBM encapsulation applications.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "SUMIKON EME mold underfill; compression-molding granules", "process": "MUF filling of solder joints and encapsulation in one molding step", "capability": "Resin viscosity and filler distribution tailored for narrow-gap filling and low warpage", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": "October 2026 plan: approximately double MUF capacity and triple granule capacity; new Singapore/Suzhou lines scheduled for end-FY2028/FY2030", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.sumibe.co.jp/english/topics/2026/it-materials/1007_01/index.html", "title": "Sumitomo Bakelite: advanced encapsulant expansion plan, 9 Oct 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "supply_capacity" ] }, { "url": "https://www.sumibe.co.jp/ir/segment/semiconductor/", "title": "Sumitomo Bakelite: HBM encapsulant applications", "accessed": "2026-11-11", "fields": [ "role" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "suss", "name": "SUSS", "url": "https://www.suss.com/", "summary": "Supplies temporary bonding and debonding systems for HBM wafer thinning. Its platforms also clean adhesive residues after the carrier is removed.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "XBS300; XBC300", "process": "Temporary bonding; debonding; adhesive-residue cleaning", "capability": "Platforms support the three wafer-support sub-processes for HBM thinning", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.suss.com/tw/news/corporate-news/2023/temporary-bonding-solutions-from-suss-microtec-enable-rapid-expansion-of-ai-applications-and-let-production-in-taiwan-grow", "title": "SUSS: temporary bonding for HBM, 15 Nov 2023", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "teradyne", "name": "Teradyne", "url": "https://www.teradyne.com/", "summary": "Supplies a tester for HBM base dies and stacks before and after singulation. Its published interface speed is a tester specification, measured differently from memory pin speed.", "tags": [ "Test" ], "fields": { "role": "Test", "offer": "Magnum 7H", "process": "Base-die wafer test; pre/post-singulated stack test", "capability": "Up to 4.5 Gbps; 9,216 digital pins and 2,560 power pins", "generations": "HBM3; HBM3E; HBM4; HBM4E", "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.teradyne.com/products/magnum-7h/", "title": "Teradyne: Magnum 7H HBM test platform", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "tokyo-electron", "name": "Tokyo Electron", "url": "https://www.tel.com/", "summary": "Supplies temporary bonding and debonding tools for the thin silicon layers used in HBM, plus a permanent-bonding platform for 3D integration.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "Synapse V; Synapse Z Plus; Synapse Si", "process": "Temporary bond/debond for TSV processing; hybrid/fusion bonding", "capability": "Synapse Si combines Cu hybrid and fusion bonding processes", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.tel.com/blog/all/20250930_001.html", "title": "Tokyo Electron: advanced-packaging R&D and 3DI equipment, 30 Sep 2025", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "toray", "name": "Toray Industries", "url": "https://www.toray.com/", "summary": "Develops temporary bonding material to support ultra-thin wafers for next-generation HBM and other devices. Its November 2025 announcement describes sample shipments and a future volume-manufacturing plan.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "Temporary bonding material for ultra-thin semiconductor wafers (samples)", "process": "Temporary carrier bonding during wafer thinning", "capability": "Targets wafers 30 µm or less in thickness", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": "November 2025 plan: use existing facilities to launch volume manufacturing by 2028", "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.toray.com/news/article.html?contentId=ev63kbmm", "title": "Toray: temporary bonding material and 2028 manufacturing plan, Nov 2025", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "towa", "name": "TOWA", "url": "https://www.towajapan.co.jp/en/", "summary": "Supplies molding equipment for stacked-memory packaging. Its HBM4 process announcement identifies a narrow-gap underfill technology and the target equipment series.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "CPM series (announced application)", "process": "Compression molding; ultra-narrow-gap mold underfill", "capability": "Announced technology targets narrow gaps in HBM4 stacks", "generations": "HBM4 (announced process target)", "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.towajapan.co.jp/jp/news/ir_20250321/", "title": "TOWA: HBM4 packaging technology announcement, 21 Mar 2025", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability", "generations" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "tsmc", "name": "TSMC", "url": "https://www.tsmc.com/", "summary": "Provides the interposer-based packaging that connects processors to HBM stacks. CoWoS is an integration service for the complete accelerator package.", "tags": [ "Packaging" ], "fields": { "role": "Packaging", "offer": "CoWoS-S; CoWoS-R; CoWoS-L", "process": "Silicon or RDL interposer integration of logic and HBM", "capability": "CoWoS-R uses an RDL interposer; in volume production since 2023", "generations": "HBM4 (SK hynix base-die collaboration)", "stack_gb": null, "stack_layers": null, "customers": "SK hynix (HBM4 base-die collaboration); Broadcom (CoWoS-based 3.5D XPU)", "supply_capacity": "April 2025 earnings call: plan to double CoWoS capacity in 2025", "market_share": null, "base_die_logic": "HBM4 base-die logic for SK hynix: advanced foundry process under April 2024 agreement", "ecosystem_partners": null }, "sources": [ { "url": "https://3dfabric.tsmc.com/english/dedicatedFoundry/technology/cowos.htm", "title": "TSMC: CoWoS advanced packaging platform", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] }, { "url": "https://news.skhynix.com/en/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership/", "title": "SK hynix: TSMC HBM4 base-die and CoWoS agreement, 19 Apr 2024", "accessed": "2026-11-11", "fields": [ "base_die_logic", "generations", "customers" ] }, { "url": "https://investors.broadcom.com/news-releases/news-release-details/broadcom-delivers-industrys-first-35d-f2f-technology-ai-xpus", "title": "Broadcom: 3.5D XPU using TSMC CoWoS, 5 Dec 2024", "accessed": "2026-11-11", "fields": [ "customers" ] }, { "url": "https://investor.tsmc.com/chinese/encrypt/files/encrypt_file/reports/2025-04/7630274eecc1197a4e3ea6a415f44a47204fe10a/TSMC%201Q25%20Transcript.pdf", "title": "TSMC: first-quarter 2025 earnings-call transcript, 17 Apr 2025", "accessed": "2026-11-11", "fields": [ "supply_capacity" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "unimicron", "name": "Unimicron", "url": "https://www.unimicron.com/en/", "summary": "Manufactures FC-BGA package substrates in the wider accelerator packaging chain. The recorded design rules are roadmap targets reproduced in Meritz research, not proof of HBM qualification.", "tags": [ "Substrates & materials" ], "fields": { "role": "Substrates & materials", "offer": "FC-BGA package substrates", "process": "Build-up wiring and core-layer interconnects", "capability": "2026 roadmap target: 150 × 150 mm body size and 5/7 µm build-up line/space", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.daeduck.com/file/board/819.do", "title": "Meritz Research: Unimicron FC-BGA roadmap, table 4, page 4, 16 Jun 2026", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false }, { "id": "yamaha-robotics", "name": "Yamaha Robotics (SHINKAWA)", "url": "https://www.yamaha-robotics.com/en/", "summary": "Supplies SHINKAWA-series package bonders for thermo-compression assembly. Yamaha positions the FPB-1s NeoForce for TSV-based HBM applications.", "tags": [ "Bonding & TSV" ], "fields": { "role": "Bonding & TSV", "offer": "FPB-1s NeoForce (SHINKAWA series)", "process": "Chip-to-substrate TCB with NCP, NCF or TC-CUF", "capability": "Bonding force up to 350 N; handles up to four chip product types", "generations": null, "stack_gb": null, "stack_layers": null, "customers": null, "supply_capacity": null, "market_share": null, "base_die_logic": null, "ecosystem_partners": null }, "sources": [ { "url": "https://www.yamaha-robotics.com/en/products/process/fpb-1s_neoforce", "title": "Yamaha Robotics: FPB-1s NeoForce product and HBM application", "accessed": "2026-11-11", "fields": [ "role", "offer", "process", "capability" ] } ], "verifiedAt": "2026-11-11", "featured": false } ] }